Capabilities

Here are most of our Capabilities:
If what you require is not listed below please contact us directly

Surface Mount Prototype Assembly
Surface Mount PCB Assembly – Small/Medium/Large Runs
Through Hole PCB Assembly - Small/Medium/Large Runs
Mechanical/Electrical Assemblies
Wiring
Re-work of Surface Mount Components
AOI Inspection
Material Procurement
Specialised Soldering Skills
Design facility available

Our surface mount production lines are capable of precision placement of BGA, fine pitch QFP’s etc. and chip size down to 0402.  We also have a fine line surface mount prototype facility offering a fast turnaround service that does not require expensive solder screen stencils.

Capabilities and Equipment

Our Equipment:
to find out more please contact us directly

DIMA HYBRID Pick & Place Machine with Pass Through Conveyors
DIMA DYMAXION Pick & Place machine with Pass Through Conveyors
DIMA FINE Line Machine with SOLDER Dispense
DIMA SOLANO 8 Zone Full Convection Reflow Oven with 400mm Belt Width
DIMA BREEZE 4 Zone Full Convection Reflow Oven with 400mm Belt Width
SM Tech High Precision Solder Paste Screen Printer With Vision Alignment
LANDREX 7301 AOI Inspection Machine
VISION MANTIS Inspection Station
BLUNDELL CMS400LF Lead Free Wave Solder Machine
BLUNDELL CMS400D Wave Solder Machine
BLUNDELL CROPMATIC Machines – 2 OFF
JBC AM6800 Rework Station
ERSA Rework Station
PCB Separator
Cliff Electronics Component Forming Machine
CAD Conversion Software
Solderstar Reflow Profiler with predictive software